533012-3
Conn Socket Strip RCP 88 POS 2.54mm Solder RA Thru-Hole
廠商型號(hào):
533012-3
芯天下內(nèi)部編號(hào):
35-533012-3
生產(chǎn)廠商:
te connectivity / amp
描述:
Conn Socket Strip RCP 88 POS 2.54mm Solder RA Thru-Hole
產(chǎn)品類別:
Interconnect|Connector Headers and PCB Receptacles
客戶編號(hào):
規(guī)格書:
查看PDF
所示圖像僅為示意圖。請(qǐng)從產(chǎn)品數(shù)據(jù)表中獲得準(zhǔn)確的規(guī)格。
庫(kù)存與訂購(gòu)
產(chǎn)品參數(shù)
| 參數(shù)類型 | 參數(shù)值 |
|---|---|
| Type | Socket Strip |
| Pitch | 2.54 mm |
| Number of Rows | 2 |
| Number of Contacts | 88 |
| Gender | RCP |
| Termination Method | Solder |
| Standard Package | Rail / Tube |
| Housing Material | Polyphenylene Sulfide |
| Connector Series | Mod II |
| Sealed | No |
| Number of Positions | 88 |
| Closed Entry | Without |
| Lead Free Solder Processes | Wave solder capable to 240?°C, Wave solder capable to 260?°C, Wave solder c |
| Solder Tail Contact Plating | Gold Flash over Nickel |
| Brand | AMP |
| Mount Angle | Right Angle |
| Product Type | Receptacle |
| Housing Entry Style | Side |
| Profile | Standard |
| Holddown Feature | Without |
| RoHSELV Compliance | RoHS compliant, ELV compliant |
| Mounting Pattern (mm (in)) | 2.54 x 7.87 [.100 x .310] |
| Contact Mating Area Plating Material | Gold (30) |
| Connector Height (mm (in)) | 6.05 [0.238] |
| GovernmentIndustry Qualification | No |
| PCB Retention Feature | No |
| Contact Type | Short Point |
| Stackable | No |
| Centerline Matrix (mm (in)) | 2.54 x 2.54 [.100 x .100] |
| Contact Material | Beryllium Copper |
| RoHSELV Compliance History | Always was RoHS compliant |
| Termination (Solder) Post Length (mm (in)) | 4.45 [0.175] |
| Factory Pack Quantity | 20 |
| Mounting Angle | Right |
| Contact Plating | Gold |
| Series | AMPMODU MOD II |
| Termination Style | Through Hole |
| Number of Positions / Contacts | 88 |
| Tradename | AMPMODU |
| RoHS | RoHS Compliant |
| Standard Pack: | 20 |
| 端子接觸部電鍍厚度?(μin) | 30 |
| Centerline (Pitch) | 2.54?mm?[?.1?in?] |
| 端子類型 | 插座 |
| 連接器類型 | 連接器組件 |
| 封裝方法 | 管 |
| スタッカブル | 否 |
| 端子基材 | 鈹銅 |
| 行數(shù) | 2 |
| 焊尾端子電鍍厚度?(μin) | 30 |
| 端子接觸部電鍍材料 | 金 |
| PC 板端接方法 | 通孔 - 焊接 |
| ハウジング導(dǎo)入口のスタイル | 側(cè) |
| 高度 | 6.05?mm?[?.238?in?] |
| ボス | 不帶 |
| MIL-C-55032 | 否 |
| 外形 | 標(biāo)準(zhǔn) |
| 產(chǎn)品類型 | 連接器 |
| Sealable | 否 |
| 端子構(gòu)成 | 短點(diǎn) |
| PCB 安裝固定 | 不帶 |
| 行間距?(in) | .31 |
| シリーズ | AMPMODU, MOD II |
| PCB 安裝方向 | 直角 |
| 外殼材料 | 聚苯硫醚 (PPS) |
| アセンブリプロセスの特徴 | 板支座 |
| 焊尾端子電鍍材料 | 鎳打底鍍金, 鎳打底鍍金 |
| 行間距?(mm) | 2.54, 7.87 |
| 連接器種類 | 母端 |
| カバーの著脫 | 不帶 |
| 封裝數(shù)量 | 20 |
| 連接器和端子端接到 | 印刷電路板 |
| 尾部長(zhǎng)度 | 4.44?mm?[?.175?in?] |
| 端接柱體長(zhǎng)度 | 4.45?mm?[?.175?in?] |
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