8-1542001-5
Heat Sink Passive BGA Pin Array Clip Aluminum/Cold-Forged Aluminum Black Anodized
廠商型號(hào):
8-1542001-5
芯天下內(nèi)部編號(hào):
35-8-1542001-5
生產(chǎn)廠商:
te connectivity / amp
描述:
Heat Sink Passive BGA Pin Array Clip Aluminum/Cold-Forged Aluminum Black Anodized
產(chǎn)品類別:
Thermal Management|Heat Sinks
客戶編號(hào):
規(guī)格書(shū):
查看PDF
所示圖像僅為示意圖。請(qǐng)從產(chǎn)品數(shù)據(jù)表中獲得準(zhǔn)確的規(guī)格。
庫(kù)存與訂購(gòu)
產(chǎn)品參數(shù)
| 參數(shù)類型 | 參數(shù)值 |
|---|---|
| Type | Passive |
| Device Cooled | BGA |
| Attachment Method | Clip |
| Product Height | 12.7 mm |
| Fin Style | Pin Array |
| Finish | Black Anodized |
| Material | Aluminum|Cold-Forged Aluminum |
| Standard Package | Bulk |
| Comment | Mounting clip does not increase overall heat sink height.; Heat sink assembly i |
| RoHSELV Compliance | RoHS compliant, ELV compliant |
| Lead Free Solder Processes | Not relevant for lead free process |
| Height (mm (in)) | 12.70 [0.500] |
| Diameter (mm in) | 50.80 [2.000] |
| Device Type | BGA |
| Flammability Rating | UL 94V-0 |
| Fan Type | Ball/Sleeve Bearing |
| Heat Sink Type | Pin Fin 4 |
| For Use With | BGA Semiconductor Packages |
| Line | ChipCoolers |
| Product Type | Heat Sink |
| RoHSELV Compliance History | Converted to comply with RoHS directive |
| Package Size (mm in) | 23 [.906] |
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| 8-1542001-1 | te connectivity / amp | Heat Sink Passive BGA Pin Array Clip Aluminum/Cold-Forged Aluminum Black Anodized | 查看詳情 |
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| 8-1542001-9 | te connectivity / amp | Heat Sink Passive BGA Pin Array Clip Cold-Forged Aluminum Black Anodized | 查看詳情 |
文檔與媒體
| 資源類型 | 鏈接 |
|---|---|
| 數(shù)據(jù)表 |