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CY7C1426KV18-300BZXC

SRAM Chip Sync Dual 1.8V 36M-Bit 4M x 9-Bit 0.45ns 165-Pin FBGA Tray

廠商型號: CY7C1426KV18-300BZXC
芯天下內部編號: 2-CY7C1426KV18-300BZXC
生產廠商:
cypress semiconductor cypress semiconductor
描述: SRAM Chip Sync Dual 1.8V 36M-Bit 4M x 9-Bit 0.45ns 165-Pin FBGA Tray
產品類別: Memory|SRAM Chip
客戶編號:
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產品參數(shù)

參數(shù)類型 參數(shù)值
Package 165FBGA
Timing Type Synchronous
Density 36 Mb
Data Rate Architecture QDR
Typical Operating Supply Voltage 1.8 V
Address Bus Width 20 Bit
Number of I/O Lines 9 Bit
Number of Ports 2
Number of Words 4 M
Architecture Pipelined
Operating Temperature 0 to 70 °C
Standard Package Trays
Mounting Surface Mount
Package Width 13
PCB 165
Screening Level Commercial
Address Bus Width 20
Typical Operating Supply Voltage 1.8
EU RoHS Compliant
Density 36M
Minimum Operating Temperature 0
Supplier Package FBGA
Standard Package Name BGA
Maximum Operating Temperature 70
Maximum Clock Rate 300
Number of Bits per Word 9
Package Length 15
Minimum Operating Supply Voltage 1.7
Pin Count 165
Maximum Operating Current 520
Package Height 0.89
Maximum Access Time 0.45
Packaging Tray
Maximum Operating Supply Voltage 1.9
Lead Shape Ball
Memory Type QDR
Factory Pack Quantity 136
Series CY7C1426KV18
Brand Cypress Semiconductor
Package / Case FBGA-165
Mounting Style SMD/SMT
Supply Current - Max 520 mA
Memory Size 36 Mbit
Supply Voltage - Max 1.9 V
Access Time 0.45 ns
Minimum Operating Temperature 0 C
Organization 4 M x 9
Maximum Clock Frequency 300 MHz
Supply Voltage - Min 1.7 V
Maximum Operating Temperature + 70 C
RoHS RoHS Compliant
Interface Type Parallel

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