OMAP3503DZCBCS
Processors - Application Specialized Applications Proc
廠商型號:
OMAP3503DZCBCS
芯天下內(nèi)部編號:
136-OMAP3503DZCBCS
生產(chǎn)廠商:
Texas Instruments

描述:
Processors - Application Specialized Applications Proc
產(chǎn)品類別:
Integrated Circuits (ICs)|Embedded - Microprocessors|OMAP-35xx
所示圖像僅為示意圖。請從產(chǎn)品數(shù)據(jù)表中獲得準(zhǔn)確的規(guī)格。
庫存與訂購
產(chǎn)品參數(shù)
參數(shù)類型 | 參數(shù)值 |
---|---|
Supplier Package | POP-FCBGA |
EU RoHS | Compliant |
Maximum Operating Temperature | 85 |
Package Height | 0.63 |
Mounting | Surface Mount |
Packaging | Tray |
Package Width | 14 |
PCB | 515 |
Package Length | 14 |
Minimum Operating Temperature | -40 |
Pin Count | 515 |
Mounting Type | Surface Mount |
Supplier Device Package | 515-POP-FCBGA (14x14) |
Voltage | 0.985 V ~ 1.35 V |
Standard Package | 168 |
Processor Type | Applications Processor |
Speed | 600MHz |
Other Names | 296-25814 |
Package/Case | 515-VFBGA, FCBGA |
rohs | Lead free / RoHS Compliant |
Status | ACTIVE |
Temp (oC) | -45 to 85 |
Package | Pins | POP-FCBGA?(CBC) | 515 |
Device Marking | View |
Package QTY | Carrier | 168 | JEDEC TRAY (10+1) |
New Flag | |
Functional Diagram | |
Datasheet | SPRS663 |
Reference Design | |
TI Design | |
HiRel | Y |
Factory Pack Quantity | 168 |
L1 Cache Data Memory | 16 kB |
Application | Application Processors |
L1 Cache Instruction Memory | 16 kB |
Package / Case | PBGA-515 |
Number of Cores | 1 Core |
Operating Supply Voltage | 985 mV to 1.35 V |
Core | ARM Cortex A8 |
Data Bus Width | 32 bit |
Instruction Type | Fixed/Floating Point |
Brand | Texas Instruments |
Mounting Style | SMD/SMT |
Memory Type | L1/L2 Cache, ROM, SRAM |
Tradename | OMAP |
Maximum Clock Frequency | 600 MHz |
Maximum Operating Temperature | + 90 C |
Data RAM Size | 64 kB |
Interface Type | 1-Wire, I2C, SPI, UART, USB |
RoHS | RoHS Compliant |
Number of Timers/Counters | 12 x 32 bit |
Data ROM Size | 112 kB |
Series | OMAP3503-HIREL |
L2 Cache Instruction / Data Memory | 256 kB |
Minimum Operating Temperature | - 45 C |
Processor Series | Sirata |
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