502382-0370
Conn Wire to Board RCP 3 POS 1.25mm Solder ST SMD Embossed T/R
廠商型號:
502382-0370
芯天下內(nèi)部編號:
256-502382-0370
生產(chǎn)廠商:
molex

描述:
Conn Wire to Board RCP 3 POS 1.25mm Solder ST SMD Embossed T/R
產(chǎn)品類別:
Interconnect|Connector Headers and PCB Receptacles
所示圖像僅為示意圖。請從產(chǎn)品數(shù)據(jù)表中獲得準(zhǔn)確的規(guī)格。
庫存與訂購
產(chǎn)品參數(shù)
參數(shù)類型 | 參數(shù)值 |
---|---|
Type | Wire to Board |
Pitch | 1.25 mm |
Number of Rows | 1 |
Number of Contacts | 3 |
Gender | RCP |
Contact Plating | Tin Over Nickel |
Termination Method | Solder |
Body Orientation | Straight |
CAD Drawing | 3D CAD Model |
Contact Material | Copper Alloy |
Current Rating | 1A |
Mounting Type | Surface Mount |
Voltage Rating | 50 V ac/dc |
rohs | Compliant |
Factory Pack Quantity | 1400 |
Mounting Angle | Vertical |
Product Category | Headers & Wire Housings |
Housing Material | Thermoplastic |
Series | 502382 |
Termination Style | Crimp |
Contact Gender | Socket (Female) |
Mounting Style | Wire |
Packaging | Reel |
Number of Positions / Contacts | 3 |
Tradename | CLIK-Mate |
Product Type | Receptacles / Sockets - PCB |
RoHS | RoHS Compliant |
Product Range | :MOLEX - CLIK-Mate 502382 Series |
Contact Termination | :Surface Mount Vertical |
No. of Contacts | :3 |
No. of Rows | :1 |
Pitch Spacing | :1.25mm |
Colour | :White |
Contact Resistance | :20mohm |
Flammability Rating | :UL94V-0 |
Insulation Resistance | :100Mohm |
Lead Spacing | :1.25mm |
Material | :Polybutylene Terephthalate |
Operating Temperature Max | :85°C |
Operating Temperature Min | :-25°C |
Voltage Rating V AC | :50V |
Withstand Voltage | :500V |
Weight (kg) | 0.000211 |
Tariff No. | 85369010 |
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